Micro-Tek has broad capabilities to produce various PTFE Dielectric cores for use in coaxial cable. These products are available in solid or stranded Silver Plated Copper (SPC) and Silver Plated Copper Clad Steel (SPCCS). Other conductor materials are available if required or customer supplied materials can be used. Our current manufacturing capabilities offer five distinct product categories; Solid PTFE, LD-Tek, Tough-Tek, PHAS-Tek and VEL-Tek.

Micro-Tek is a specialty manufacturing company focused on creating value-added fluoropolymer-based products for avionics, military, space, telecommunications and medical industries. Micro-Tek is widely recognized as a global technology leader in fluoropolymer extrusion. With expertise in bonding fluoropolymers, etching systems, profile cable core Micro-Tek has demonstrated the ability to rapidly develop new technology for the changing needs of the market.

Solid PTFE

PTFE has the lowest dielectric constant (2.05) and lowest loss tangent of any plastic making it ideal for use in coaxial core applications. Fully sintered PTFE is very robust as a dielectric. PTFE is subject to phase instability, primarily around its first order transition temperature of about 66 F; this phase instability will cause signal delay in a coaxial cable.

Size Range:
Conductor: 0.0028” (#41awg) to 0.064” (#14awg)
Wall Thickness: from 0.004” to 0.040”
OD: from 0.015” to 0.120”

LD-Tek & Tough-Tek Low Density PTFE Coaxial Core

Micro-Tek’s LD-Tek (low density) polytetrafluoroethylene (PTFE) coaxial core takes our conventional core to higher levels of performance by increasing the core’s velocity of propagation and lowering dielectric loss. LD-Tek is available over a similar range of diameters and conductors as our conventional core but offers VoPs as high as 76%- 78% This product is supplied as a component to manufacturers of flexible and semi-rigid RF and microwave coaxial cables.

Where a more robust dielectric is desired, Tough-Tek low density polytetrafluoroethylene (PTFE) can be specified. Micro-Tek can adjust the manufacturing process to provide adjustments to the VoP as well as alter the outer surface of the dielectric to provide a tougher outer skin to protect the core in more dynamic applications. Tough-Tek is available in the range of 75%-78% VoP.

PHAS-Tek Phase Stable Core

Using Chemours FFR resins, Micro-Tek’s PHAS-Tek low density coaxial core takes our conventional core to higher levels of performance by increasing the core’s velocity of propagation. PHAS-Tek is not subject to the phase instability seen in PTFE giving these cores’ stable and reliable performance over the full temperature range with the tradeoff of a higher dielectric loss. PHAS-Tek is available over a wider range of diameters and conductors as our conventional core with VoPs from 76%- 82%. One of this core’s best suited applications is in aircraft and is supplied as a component to manufacturers of flexible and semi-rigid RF and microwave coaxial cables.

Size Range:
Conductor: 0.020” (#24awg) to 0.064” (#14awg)
Wall Thickness: from 0.015” to 0.060”
OD: from 0.050” to 0.180”

VEL-Tek High Velocity PTFE Coaxial Core

The highest performing core technology available! VEL-Tek Cables have low structural VSWR, VOPs 80% to 90%, and enable wider degrees of freedom for finished cable manufacturing.

Micro-Tek’s VEL-Tek Coax Core allows cable designers to meet the demanding performance character. Expanded, or VEL-Tek core, offers the ability to be produced with a VoP between 78 and up to 90% (with an ideal construction), this core’s VoP will improve its phase stability as there will be even less PTFE per unit volume than that of either low-loss or fully sintered conventional core. This type of core sometimes competes with tape wrapped core. Its advantages over PTFE tape wrapping is that it can be made to a higher VoP and is mechanically more robust than tape wrap (the seams in tape wrapping can sometimes be problematic). PTFE tape wrap will have a little lower loss as it is generally completely unsintered and has no tie layer which can cause adhesion issues.

Applications include high frequency/microwave military, aerospace, communications and testing.